PowerDI5 Product

Manufacturer:

Diodes, Inc. / Zetex

Product Highlights:

- Small footprint, low profile package is ideal for space-constrained applications, such as
portable electronics.

- Qualified to rigorous AEC-Q101 automotive standards to ensure high reliability.

- Excellent stability even under high ambient temperatures and reverse bias up to 400 Volts.

- RoHS Compliant: Lead free terminal plating and green molding compound assure
compliance to the highest environmental standards.


Dimensional Highlights:

- Low profile: Only 1.1mm tall, ideal for height limited applications.
Compare with 2.3mm for SMC and DPAK, and 4.4mm for D2PAK.

- Small footprint: Occupies only 23.8mm2 of PCB area, which can be compared with:
o 47mm2 for SMC (PowerDITM5 consumes 49% less area than SMC)
o 61.5mm2 for DPAK (PowerDITM5 consumes 55% less area than DPAK)


Thermal Performance Benefits:

- Twice the Power Density of Competitive Package Types --
Highest power density package: 55mW/mm2, which can be compared with:
o 25mW /mm2 for SMC
o 28 mW /mm2 for DPAK

- Up to 50% Lower Thermal Resistance than Competitive


Package Types:

Thermally efficient package: ReJS = 1.5 - 6.0oC/W, which can be compared with:
o 10 - 15oC/W for SMC
o 2.4 - 6.0oC/W for DPAK


Solderability & Environmental Highlights:

- RoHS Compliant
- “Green” (No Bromine, Antimony) Molding Compound
- Pb-Free, 100% Matte Tin Plating
- Withstands 260°C Solder Reflow
- Meets Moisture Sensitivity Level (MSL) 1


End Equipment Applications:

- Automotive
- Disk drives
- Inverters
- Power management circuits
- Industrial controls
- Set top boxes
- Networking equipment, routers, hubs
- Computer peripherals; printers